- Market Research
- Semiconductor Assembly and Testing Services Market Segmented By Assembly and Packaging Services, Copper Wire and Gold Wire Bonding, Flip Chip, Wafer Level Packaging, TSV, Testing Services in Communication, Computing and Networking, Consumer Electronics, Industrial, Automotive Electronics
Increasing demand for semiconductor assembly and testing services (SATS) in communication and packaging solutions, limitations of electronics outsourcing services, and rapid growth of semiconductor packaging landscape are expected to propel growth of semiconductor assembly and testing market in the forecast period of 2019 - 2029.
The market is projected to witness significant growth over the forecast period, due to several factors such as growing penetration of smartphones and solid-state drives (SSDs), and increasing adoption of semiconductor assembly & testing services to meet customer expectations.
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- ASE Group, Inc.
- Amkor Technology, Inc.
- Siliconware Precision Industries Co., Ltd.
- Powertech Technology, Inc.
- United Test and Assembly Center Ltd.
- JCET Group Co Ltd
- Chips Technologies, Inc.
- Chipbond Technology Corporation.
- King Yuan Electronics Co Ltd
Increasing Preference for (WLP) Interconnecting Technology
Wafer-level packaging (WLP) interconnecting technology is an advanced packaging technology wherein die interconnects are manufactured and tested on the wafer. These interconnects have wider pitch and larger ball structures as compared to associated flip chip structures.
WLP is rapidly replacing traditional packaging technologies with growing adoption of wireless portable applications that demand small form factor, low thermal and power ratings, and light weight. Expanding assembly & packaging services and the gradual increase in demand from end use industries such as consumer electronics and communication and automotive, especially in developing regions such as Asia Pacific, Latin America, and the MEA is projected to boost demand for semiconductor assembly and testing services.
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Advantageous Features over In-house Testing and Packaging Capabilities
Semiconductor assembly and testing services offers different features such as flexibility for varying performance requirements utilizing multilayer organic build-up substrates, well-established process equipment expertise, proven construction, and lower stress on active area.
Flip chip facilitates a higher number of interconnects as compared to packaging solutions employing wire bonding technology, as it uses the entire surface area of the die, and sometimes the perimeter as well. The reliability of such features drive growth of the semiconductor assembly and testing services market.
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Increasing Application in Automobile Electronics Sector
Advancements in automotive electronics in next-generation cars equipped with electronic components and systems to enhance car safety and management systems are a prime factor driving the growth of the semiconductor assembly and testing services market.
Rising adoption of advanced electronics in sophisticated engine and safety controls, navigation, audio/video systems, hybrid electric drives, and LED lighting creates significant opportunities for players in the semiconductor assembly and testing services market.
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Lucrative Growth Opportunities Abound in Asia Pacific
The semiconductor assembly and testing services market is witnessing rapid growth in the Asia Pacific region due to increasing adoption of tablets and wearable devices.
Semiconductor assembly and testing services market providers strive to expand their operations in China, South Korea, and India to unlock new growth avenues, attributable to growing demand for consumer electronics and vast expansion of electronic industries in these countries.
Semiconductor Assembly and Testing Services Market – Competition Landscape
Introduction of new services and partnerships & collaborations are key strategies followed by top players in the market to increase their business revenue. Semiconductor assembly and testing service providers focus on innovation in products/services to improve their market positions.
Some leading players in the semiconductor assembly and testing services market are Powertech Technology Inc., STATS ChipPAC Ltd. (JCET), ASE Group, Silicon Precision Industries Co. Ltd., Amkor Technologies Inc., and Chipbond Technology Corporation.
Over the last few years, emergence of 3D semiconductor assemblies and increased demand for outsourced semiconductor assembly and testing services (OSATS) are creating significant growth opportunities for players in the semiconductor assembly and testing services market.
Among various regions, Asia Pacific excluding Japan is the most prominent region and holds a market share of 34%.
Semiconductor Assembly and Testing Services Market: Segmentation
PMR’s report on the global semiconductor assembly and testing services market offers a detailed market segmentation, wherein key segments have been discussed in detail.
This report by PMR carefully examines the semiconductor assembly and testing services market at a global as well as regional level, through market segmentation on the basis of multiple parameters such as service, application, and region. Every segment has been analyzed in detail, and data pertaining to the growth of each segment has been included in the report.
Semiconductor Assembly and Testing Services Market: Key Questions Answered in Report
- How has the semiconductor assembly and testing services market progressed over the last four years?
- What are some prominent dynamics in the semiconductor assembly and testing services market?
- What are competitive trends and recent developments in the semiconductor assembly and testing services market?
- What are significant opportunities, challenges, and improvements for semiconductor assembly and testing services market players?
- What are the underlying macroeconomic factors impacting growth of the semiconductor assembly and testing services market?
- How has the market structure developed over the last few years?