Semiconductor Assembly Test Services Market : TOC

Table of Contents
 

1. Global Semiconductor Assembly and Testing Services Market- Executive Summary
 

2. Assumptions & Acronyms Used
 

3. Research Methodology
 

4. Market Overview
4.1. Introduction
    4.1.1. Global Semiconductor Assembly and Testing Services Market Definition
    4.1.2. Global Semiconductor Assembly and Testing Services Market Taxonomy
4.2. Global Semiconductor Assembly and Testing Services Market Dynamics
    4.2.1. Drivers
    4.2.2. Restraints
4.3. Value Chain
4.4. Global Semiconductor Assembly and Testing Services Market Forecast, 2015-2021
    4.4.1. Global Semiconductor Assembly and Testing Services Market Size (Value) Forecast
          4.4.1.1. Y-o-Y Growth Projections
          4.4.1.2. Absolute $ Opportunity
4.5. Global Semiconductor Assembly and Testing Services Market Trends
4.6. Global Semiconductor Assembly and Testing Services Market Snapshot (2014)
    4.6.1. Market Share By Services
    4.6.2. Market Share By Packaging Solutions
    4.6.3. Market Share By Applications
    4.6.4. Market Share By Regions

5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
    5.2.1. Assembly & Packaging services (Interconnecting technologies) 
          5.2.1.1.1. Copper and gold wire bonding
          5.2.1.1.2. Copper clip
          5.2.1.1.3. Flip Chip
          5.2.1.1.4. Wafer Level Packaging
          5.2.1.1.5. TSV
    5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services
5.7. Qualitative Analysis

6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
6.1. Introduction
6.2. Global Semiconductor Assembly and Testing Services Market Forecast By Packaging Solutions
    6.2.1. Copper/gold Wire Bonding
    6.2.2. Copper Clip
    6.2.3. Flip Chip
    6.2.4. Wafer Level Packaging
    6.2.5. 3D TSV
6.3. Basis Point Share (BPS) Analysis, By Packaging Solutions
6.4. Y-o-Y Growth Comparison, By Packaging Solutions
6.5. Absolute $ Opportunity, By Packaging Solutions
6.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions
6.7. Qualitative Analysis

7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
7.1. Introduction
7.2. Global Semiconductor Assembly and Testing Services Market Forecast By Applications
    7.2.1. Communications
    7.2.2. Computing & Networking
    7.2.3. Consumer Electronics
    7.2.4. Industrial
    7.2.5. Automotive Electronics
7.3. Basis Point Share (BPS) Analysis, By Applications
7.4. Y-o-Y Growth Comparison, By Applications
7.5. Absolute $ Opportunity
7.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions
7.7. Qualitative Analysis

8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
8.1. Introduction
8.2. Global Semiconductor Assembly and Testing Services Market Forecast By Region
    8.2.1. North America Market Value Forecast
    8.2.2. Asia Pacific (Excluding Taiwan) Market Value Forecast 
    8.2.3. Taiwan Market Value Forecast
    8.2.4. Europe Market Value Forecast
    8.2.5. Middle East & Africa Market Value Forecast
    8.2.6. Latin America Market Value Forecast
8.3. Y-o-Y Growth Projections, By Region
8.4. Basis Point Share (BPS) Analysis, By Region
8.5. Market Attractiveness Analysis, By Region

9. North America North America Semiconductor Assembly and Testing Services Market Analysis
9.1. Market overview
9.2. Introduction
    9.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
9.3. North America Semiconductor Assembly and Testing Services Market Forecast
    9.3.1. Market Value Forecast By Services
          9.3.1.1. Assembly & Packaging services 
          9.3.1.2. Testing services
                  9.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  9.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    9.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          9.3.2.1. Copper/gold wire bonding
          9.3.2.2. Copper Clip
          9.3.2.3. Flip Chip
          9.3.2.4. Wafer level Packaging
          9.3.2.5. 3D TSV
                  9.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  9.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    9.3.3. Market Value Forecast By Applications
          9.3.3.1. Communications
          9.3.3.2. Computing and Networking
          9.3.3.3. Consumer Electronics
          9.3.3.4. Industrial
          9.3.3.5. Automotive Electronics
                  9.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  9.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    9.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          9.3.4.1. By Services
          9.3.4.2. By Packaging Solutions
          9.3.4.3. By Applications
    9.3.5. Drivers & Restraints: Impact Analysis

10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
10.1. Market overview
10.2. Introduction
    10.2.1. Y-o-Y Growth Projections, By Country
    10.2.2. Basis Point Share (BPS) Analysis, By Country
10.3. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Forecast
    10.3.1. Market Value Forecast By Country
          10.3.1.1. China Absolute $ Opportunity
          10.3.1.2. Japan Absolute $ Opportunity
          10.3.1.3. Singapore Absolute $ Opportunity
          10.3.1.4. Thailand Absolute $ Opportunity
          10.3.1.5. Philippines Absolute $ Opportunity
                  10.3.1.5.1. Y-o-Y Growth Comparison, By Countries
                  10.3.1.5.2. Basis Point Share (BPS) Analysis, By Countries
    10.3.2. Market Value Forecast By Services
          10.3.2.1. Assembly & Packaging services 
          10.3.2.2. Testing services
                  10.3.2.2.1. Y-o-Y Growth Comparison, By Services
                  10.3.2.2.2. Basis Point Share (BPS) Analysis, By Services
    10.3.3. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          10.3.3.1. Copper/gold wire bonding
          10.3.3.2. Copper Clip
          10.3.3.3. Flip Chip
          10.3.3.4. Wafer level Packaging
          10.3.3.5. 3D TSV
                  10.3.3.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  10.3.3.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    10.3.4. Market Value Forecast By Applications
          10.3.4.1. Communications
          10.3.4.2. Computing and Networking
          10.3.4.3. Consumer Electronics
          10.3.4.4. Industrial
          10.3.4.5. Automotive Electronics
                  10.3.4.5.1. Y-o-Y Growth Comparison, By Applications
                  10.3.4.5.2. Basis Point Share (BPS) Analysis, By Applications
    10.3.5. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          10.3.5.1. By countries
          10.3.5.2. By Services
          10.3.5.3. By Packaging Solutions
          10.3.5.4. By Applications
    10.3.6. Drivers & Restraints: Impact Analysis

11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
11.1. Market overview
11.2. Introduction
    11.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
11.3. Taiwan Semiconductor Assembly and Testing Services Market Forecast
    11.3.1. Market Value Forecast By Services
          11.3.1.1. Assembly & Packaging services 
          11.3.1.2. Testing services
                  11.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  11.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    11.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          11.3.2.1. Copper/gold wire bonding
          11.3.2.2. Copper Clip
          11.3.2.3. Flip Chip
          11.3.2.4. Wafer level Packaging
          11.3.2.5. 3D TSV
                  11.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  11.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    11.3.3. Market Value Forecast By Applications
          11.3.3.1. Communications
          11.3.3.2. Computing and Networking
          11.3.3.3. Consumer Electronics
          11.3.3.4. Industrial
          11.3.3.5. Automotive Electronics
                  11.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  11.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    11.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          11.3.4.1. By Services
          11.3.4.2. By Packaging Solutions
          11.3.4.3. By Applications
    11.3.5. Drivers & Restraints: Impact Analysis

12. Europe Semiconductor Assembly and Testing Services Market Analysis
12.1. Market overview
12.2. Introduction
    12.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
12.3. Europe Semiconductor Assembly and Testing Services Market Forecast
    12.3.1. Market Value Forecast By Services
          12.3.1.1. Assembly & Packaging services 
          12.3.1.2. Testing services
                  12.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  12.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    12.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          12.3.2.1. Copper/gold wire bonding
          12.3.2.2. Copper Clip
          12.3.2.3. Flip Chip
          12.3.2.4. Wafer level Packaging
          12.3.2.5. 3D TSV
                  12.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  12.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    12.3.3. Market Value Forecast By Applications
          12.3.3.1. Communications
          12.3.3.2. Computing and Networking
          12.3.3.3. Consumer Electronics
          12.3.3.4. Industrial
          12.3.3.5. Automotive Electronics
                  12.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  12.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    12.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          12.3.4.1. By Services
          12.3.4.2. By Packaging Solutions
          12.3.4.3. By Applications
    12.3.5. Drivers & Restraints: Impact Analysis

13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
13.1. Market overview
13.2. Introduction
    13.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
13.3. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Forecast
    13.3.1. Market Value Forecast By Services
          13.3.1.1. Assembly & Packaging services 
          13.3.1.2. Testing services
                  13.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  13.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    13.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          13.3.2.1. Copper/gold wire bonding
          13.3.2.2. Copper Clip
          13.3.2.3. Flip Chip
          13.3.2.4. Wafer level Packaging
          13.3.2.5. 3D TSV
                  13.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  13.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    13.3.3. Market Value Forecast By Applications
          13.3.3.1. Communications
          13.3.3.2. Computing and Networking
          13.3.3.3. Consumer Electronics
          13.3.3.4. Industrial
          13.3.3.5. Automotive Electronics
                  13.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  13.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    13.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          13.3.4.1. By Services
          13.3.4.2. By Packaging Solutions
          13.3.4.3. By Applications
    13.3.5. Drivers & Restraints: Impact Analysis

14. Latin America Semiconductor Assembly and Testing Services Market Analysis
14.1. Market overview
14.2. Introduction
    14.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
14.3. Latin America Semiconductor Assembly and Testing Services Market Forecast
    14.3.1. Market Value Forecast By Services
          14.3.1.1. Assembly & Packaging services 
          14.3.1.2. Testing services
                  14.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  14.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    14.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          14.3.2.1. Copper/gold wire bonding
          14.3.2.2. Copper Clip
          14.3.2.3. Flip Chip
          14.3.2.4. Wafer level Packaging
          14.3.2.5. 3D TSV
                  14.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  14.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    14.3.3. Market Value Forecast By Applications
          14.3.3.1. Communications
          14.3.3.2. Computing and Networking
          14.3.3.3. Consumer Electronics
          14.3.3.4. Industrial
          14.3.3.5. Automotive Electronics
                  14.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  14.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    14.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          14.3.4.1. By Services
          14.3.4.2. By Packaging Solutions
          14.3.4.3. By Applications
    14.3.5. Drivers & Restraints: Impact Analysis

15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
    15.4.1. ASE Group
          15.4.1.1. Revenue
          15.4.1.2. Products/Brand Offerings
          15.4.1.3. Company Highlights
    15.4.2. Amkor Technology Inc.
    15.4.3. STATS chipPAC Ltd. (JCET)
    15.4.4. Powertech Technology Inc.
    15.4.5. Silicon Precision Industries Company Ltd.
    15.4.6. CORWIL Technology Corp.
    15.4.7. Chipbond Technology Corporation
    15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
    15.4.9. GlobalFoundries Inc.