Global Market Study on Electronic Board Level Underfill and Encapsulation Material: Rapid Growth of Electronics Industry Fuelling Demand


Electronic Board Level Underfill And Encapsulation Material  Market
  • Published On : Sep-2020 |
  • Pages : 300 Pages |
  • Format : Electronic Board Level Underfill And Encapsulation Material  Market Electronic Board Level Underfill And Encapsulation Material  Market Electronic Board Level Underfill And Encapsulation Material  Market Electronic Board Level Underfill And Encapsulation Material  Market

Electronic board level underfill and encapsulation material is used for making and assembling components on printed circuit boards that are used in various electronic equipment such as mobiles, tablets, laptops, consumer electronics, etc. The electronics industry has witnessed tremendous growth in recent years, owing to increasing traction for the demand for smartphones and wireless equipment. In addition, growth in the integration of electronic components in automotive as well as medical equipment will propelling the demand for electronic board level underfill and encapsulation material over the coming years. As such, the expansion of the electronic board level underfill and encapsulation material market size is projected to witness a significantly upward trend during the forecast period of 2020 to 2030.

Electronic Board Level Underfill and Encapsulation Material Market Trends

Increasing Prominence of Electronic Component Miniaturization: Miniaturization of electronic devices has led to an increase in the number of components on printed circuit boards. This growing trend has enhanced the demand for smaller, thinner, and more highly integrated printed circuit board (PCBs) that are populated with flip chip technology. This nanotechnology and micro electromechanical systems (MEMS) are growing in functionality as well as acceptance in a majority of applications among various industries such as consumer electronics and others. The current pace of miniaturization of electronic devices will result in a surge in the demand for PCBs in the near future. Miniaturization of electronic devices such as laptops, smartphones, consumer electronics, and many more has led to increased usage of underfill material in encapsulation and cavity filling type applications. This, in turn, is expected to augment the growth of the electronic board level underfill and encapsulation material market.

Growing Investments in Electronic Manufacturing Creates Striking Opportunities for Market: The electronics industry is an extensive economic sector that covers advanced technologies in the productive, industrial, and consumer goods market. The electronics and electrical industry is a flourishing and diversified sector, which is promptly growing owing to inventions of novel technologies coupled with customers inclining toward electronic devices and services. Rapid surge in the growth of the electronics industry has led to a dramatic rise in investments in the electronics manufacturing industry.

Nowadays, the electrical and electronics industry is experiencing remarkable changes due to continuous research & development investments, which has led to augmented production capacity as well as higher value-added products. All this is boding well for the progress of the global electronic board level underfill and encapsulation material market.

Expanding Consumer Electronics Market: Consumer electronics is not only a rapidly growing market but also one of the comprehensive market spaces. With tablets, smartphones, and other devices getting updated on a rapid time scale, consumers are always on the lookout for new and innovative products. Thus, the electronics industry today mainly develops components and system solutions for various business areas, which will continue and create investment opportunities for various players in the market. Moreover, consumers, on an average, spend a considerable amount on smartphones. This is attributable to increasing disposal income in developed and developing countries. The launch of new generation smartphones will also drive the electronic board level underfill and encapsulation material market.

Regional Outlook of Electronic Board Level Underfill and Encapsulation Material Market

In terms of regional distribution, global demand is dominated by East Asia, which accounted for nearly one-fourth of the electronic board level underfill and encapsulation material market share in 2019. The region is projected to continue to be the most significant demand center for electronic board level underfill and encapsulation material throughout the forecast period. Further, the region is dominant on not just the demand front, but also on the supply front, with China and Taiwan accounting for a bulk of global production capacity.

Manufacturers’ Focus: Expansion of Global Production and Supply Network

The global Electronic board level underfill and encapsulation material market is a highly competitive space. In order to gain maximum customers, manufacturers are expanding their footprints across the world. Also, continuing efforts are being made to further improve the cost and performance parameters of different applications. Manufacturers are focusing on expansion of their production and distribution networks in the Asia Pacific region, owing to the prevalence of a large number of electronic component manufacturers in the region.

COVID-19 Impact on Electronic Board Level Underfill and Encapsulation Material Market

The COVID-19 pandemic led to widespread operational disruptions in major production hubs of the electronics industry, such as China, Japan, and South Korea. This impeded the steady growth of the electronic board level underfill and encapsulation material market. However, recovery has been comparatively quick in these regions as compared to others, which will allow the market to gradually get back to its normal growth trajectory.

Analysts’ Viewpoint

Growth of the electronic board level underfill and encapsulation material market is largely driven by demand in smartphones, Internet infrastructure, wireless devices, computers, and increasing use of electronics in automobiles. Growth of consumer electronics over the past years has been remarkable, and this growth is estimated to persist over the forecast period too. This, in turn, will set the path for market growth over the coming years.

Electronic Board Level Underfill and Encapsulation Material Market - Scope of the Report

Persistence Market Research (PMR) recently published a report on the global electronic board level underfill and encapsulation material market. The report provides detailed valuation on key market dynamics, such as the drivers, trends, opportunities, and restraints, along with detailed information about the electronic board level underfill and encapsulation material market structure. This market research report presents exclusive facts and figures about how the electronic board level underfill and encapsulation material market will grow over the forecast period of 2020 to 2030.

Key indicators of market background, such as value chain analysis and supply chain, compounded annual growth rate (CAGR), and year-on-year (Y-o-Y) growth of the market are explained in PMR’s study in a comprehensive manner. This information can help readers understand the quantitative development projections of the electronic board level underfill and encapsulation material market over the forecast period.

The study is relevant for stakeholders in the electronic board level underfill and encapsulation material market, as well as manufacturers, distributors, suppliers, and investors, as it can help them understand the applicable strategies to grow in the market. Stakeholders, investors, industry experts, researchers, and journalists, as well as business researchers in the electronic board level underfill and encapsulation material market can leverage the information and statistics presented in PMR’s research report.

The report includes facts and figures related to the macro- as well as micro-economic factors that are impacting the growth of the electronic board level underfill and encapsulation material market. The study also offers actionable insights based on future trends in the electronic board level underfill and encapsulation material market. Furthermore, regional players and new entrants in the electronic board level underfill and encapsulation material market can also use the information presented in this report to make business decisions and gain momentum in the market.

Key Segments of Electronic Board Level Underfill and Encapsulation Material Market

PMR’s study on the electronic board level underfill and encapsulation material market is divided into four significant segments - product type, material, board type, and region. This report offers comprehensive data and information about the important market dynamics and growth parameters related to these categories.

Product Type

Material

Board Type

Region

  • Underfills
    • Capillary
    • Edge Bonds
  • Gob Top Encapsulations
  • Quartz/Silicone
  • Alumina-based
  • Epoxy -based
  • Urethane -based
  • Acrylic -based
  • Others
  • CSP (Chip Scale Packages)
  • BGA (Ball Grid Arrays)
  • Flip Chips
  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia & Pacific 
  • Middle East & Africa

Key Questions Answered in PMR’s Electronic Board Level Underfill and Encapsulation Material Market Report

  • Which region is anticipated to hold a prominent market share over the forecast period?
  • What will be the key driving factors propelling the demand for electronic board level underfill and encapsulation material during the forecast period?
  • How current trends will impact the electronic board level underfill and encapsulation material market?
  • Who are significant market participants in the Electronic board level underfill and encapsulation material market?
  • What are the crucial strategies of prominent players in the electronic board level underfill and encapsulation material market to upscale their positions in this landscape?

Electronic Board Level Underfill and Encapsulation Material Market: Research Methodology

In PMR’s research report, exclusive research methodology is utilized to conduct comprehensive research on the development of the electronic board level underfill and encapsulation material market, and reach conclusions on the future growth factors of the market. In this research methodology, secondary and primary research is utilized by analysts to ensure the precision and reliability of the conclusions.

Secondary resources are referred to by analysts during the evaluation of the electronic board level underfill and encapsulation material market study, which comprise facts and figures from World Bank, IMF, US Energy Information Administration, International Energy Agency, local & regional government websites, white papers, trade journals, and external and internal databases. Analysts have thoroughly interviewed several industry experts, such as sales supervisors, sales operation managers, product portfolio managers, senior managers, market intelligence managers, marketing/product managers, engineering managers, and production managers to provide insightful information.

Comprehensive information acquired from primary and secondary resources is validated from companies operating in the electronic board level underfill and encapsulation material market to make PMR’s projections on the growth prospects of the market more accurate and reliable.

Companies covered in Electronic Board Level Underfill And Encapsulation Material Market Report

  • Namics Corporation
  • AI Technology, Inc.
  • Protavic International
  • H.B. Fuller Company
  • ASE Group
  • Hitachi Chemical Co., Ltd.
  • Indium Corporation
  • Zymet
  • YINCAE Advanced Materials, LLC  
  • LORD Corporation  
  • Sanyu Rec Co., Ltd.  
  • The Dow Chemical Company
  • Epoxy Technology, Inc.
  • Panasonic Corporation
  • Dymax Corporation
  • ELANTAS GmbH

Electronic Board Level Underfill And Encapsulation Material Market

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