Global Market Study on Thermosetting Moulding Materials for Electronics: Growing Need for Semiconductor Filler Materials Primarily Driving Demand


Thermosetting Moulding Materials Electronics  Market
  • Published On : Oct-2018 |
  • Pages : 334 Pages |
  • Format :

Persistence Market Research (PMR) provides an exclusive analysis of “Global Thermosetting Resin Moulding Materials for Electronics Market”. The main aim of this report is to offer exhaustive analysis and provide insights pertaining to the Thermosetting Resin Moulding Materials for Electronics market. This report offers a comprehensive analysis of the global Thermosetting Resin Moulding Materials for Electronics market in terms of volume (tons) & value (US$ Mn) and year-wise (Y-o-Y) growth in sales of Thermosetting Resin Moulding Materials for Electronics according to application and end use. For better understanding of market, report is loaded with analysis of factors such as drivers, trends, restraints, and their impact on the market dynamics. The Thermosetting Resin Moulding Materials for Electronics report is segmented into three sections viz. by base material, by application, and by region, to offer insights on the global Thermosetting Resin Moulding Materials for Electronics market.

Report Description

The report on global Thermosetting Resin Moulding Materials for Electronics market starts with executive summary and market introduction, which provide a complete view of the market. This section includes Market view point, value chain analysis and forecast factors impact analysis related to Thermosetting Resin Moulding Materials for Electronics Market. Additionally, the Thermosetting Resin Moulding Materials for Electronics report provides valuable information regarding cost of production, comparative analysis between high purity quartz and other substitute materials used as well as detailed value chain analysis of the Thermosetting Resin Moulding Materials for Electronics Market. The section that follows analyses the global Thermosetting Resin Moulding Materials for Electronics market on the basis of its segments and presents forecast for the period of 2018-2026. On the basis of composition, the global Thermosetting Resin Moulding Materials for Electronics market is segmented into;

  • Base Material
  • Application
  • End Use

First section include analysis of Thermosetting Resin Moulding Materials for Electronics market on the basis of Base Material and it is segmented as

  • High Purity Quartz (HPQ)
    • Lower Purity Grades
    • HPQ Powder
    • Grade I HPQ
    • Grade II HPQ
    • Grade III HPQ
  • Competitive Products
    • Fumed Silica
    • Spherulised Fused Silica
    • Synthetic Silica
    • Crystal Silica
    • Ti, Al, Zr, Ferrite Powders

Second section include analysis of Thermosetting Resin Moulding Materials for Electronics market on the basis of Application and it is segmented as

  • Epoxy
  • Polyester
  • Polyurethane
  • Polyimide
  • Formaldehyde, and melamine formaldehyde
  • Bakelite
  • Others

Third section include analysis of Thermosetting Resin Moulding Materials for Electronics market on the basis of End Use and it is segmented as

  • Consumer Electronics
  • Automotive
  • Aerospace

The following section i.e. region, includes analysis of the global Thermosetting Resin Moulding Materials for Electronics market on the basis of seven regions: North America, Latin America, South East Asia & Pacific, Mainland China, Japan, Europe and Middle East and Africa

Last section of the Thermosetting Resin Moulding Materials for Electronics report includes competitive landscape, which include market share analysis and provides information and analysis of companies based on categories of manufactures across the value chain and their presence in the global Thermosetting Resin Moulding Materials for Electronics market. Some of the market players included in this section are Unimin-Sibelco, Samsung SDI Co. Ltd.,  Golovach Quartz, Momentive,, The Quartz Corporation, Kyocera Chemical Corporation, Tosoh Corporation, ANZAPLAN GmbH, HPQ Silicon, Jiangsu Pacific Quartz Co.,Russian Quartz LLC –Kyshtym Mining –Sumitomo, Nordic Mining ASA, CB Minerals and others

Research Methodology

Market energy consumption is inferred through in-depth secondary research and validated from industry experts and key manufacturer/ solution providers through primary interviews. Each interview is thoroughly analyzed and average market energy consumption is deduced and reconfirmed prior to incorporating in the report. For the market analysis, we have considered 2017 as base number with estimated new Thermosetting Resin Moulding Materials for Electronics sale in 2018 and forecast is made for years 2019 to 2026. The market size is calculated with different type of Thermosetting Resin Moulding Materials for Electronics and according to their selling prices in respective regions. Further, data point such as sales split, end use and application split and regional split, along with qualitative inputs from the primary research are incorporated in order to provide precise market analysis. The forecast presented in this report estimates the total revenue that is projected to be generated across the Thermosetting Resin Moulding Materials for Electronics market over forecast period (2018–2026). 

In this report, we have conducted forecasts in terms of CAGR and analyzed market on the basis of Year-on-Year (Y-o-Y) growth in order to understand the behavior of the market and identify opportunities in Thermosetting Resin Moulding Materials for Electronics market.  Moreover, for better understanding of each segment growth, we have analyzed the global Thermosetting Resin Moulding Materials for Electronics market in terms of Absolute Dollar Opportunity and Basis Point Share (BPS), which provide in-depth information about potential resources and key trends involved in the Thermosetting Resin Moulding Materials for Electronics market. Along with this, PMR used market attractive index that provides information about the performance and growth of each key segment in the global Thermosetting Resin Moulding Materials for Electronics market.

Thermosetting Resin Moulding Materials for Electronics is considered under the scope of the report is used in Semiconductors & Microelectronics Fillers

The global Thermosetting Resin Moulding Materials for Electronics market is estimated to be valued at US$ 1,139.3 Mn by 2018 end and is expected to reach US$ 1,685.6 Mn by the end of 2026, expanding at a CAGR of 5.0% over the forecast period. The global Thermosetting Resin Moulding Materials for Electronics market is anticipated to represent incremental opportunity of US$ 546.3 Mn between 2018 and 2026. The global High Purity Quartz is anticipated to increase to US$ 335.8 by 2026, exhibiting a CAGR of 5.6% over the forecast period.

Increasing use of thermosetting resin moulding materials for electronics resins for the manufacturing of electrical laminates

Thermosetting Resin Moulding Materials for Electronics resins are used for the manufacturing of printed circuit boards, prepregs and copper clad laminates, amongst others. With rise in demand for lighter, shorter, thermally stable and reliable circuit boards, Thermosetting Resin Moulding Materials for Electronics are gaining prominence in the digital world. Owing to good adhesion, high electrical insulation and mechanical and thermal stability properties of Thermosetting Resin Moulding Materials for Electronics resins, their use has grown significantly over the past decade. The number of PCBs (Printed Circuit Boards) manufactures using Thermosetting Resin Moulding Materials for Electronics resins installed in cars has grown exponentially over the past few years. With growing demand for autonomous vehicles, a rise in demand for such electronic components is expected to drive demand of resins for Thermosetting Resin Moulding Materials for Electronics resins.

Consumer electronics segment to register relatively high value and energy consumption CAGR among end use segments

On the basis of base material, the global Thermosetting Resin Moulding Materials for Electronics market is segmented into High Purity Quartz (Lower Purity Grade, HPQ Powder, Grade I HPQ, Grade II HPQ and Grade III HPQ) and Competitive Products (Fumed Silica, Spherulised Fused Silica, Synthetic Silica, Crystal Silica and Ti, Al, Zr, Ferrite Powders).

On the basis of application, the global Thermosetting Resin Moulding Materials for Electronics market is segmented into Epoxy, Polyester, Polyurethane, Polyimide, Formaldehyde, and melamine formaldehyde, Bakelite and Others. Among them, polycrystalline segment accounted for 85.2% share in 2017 in terms of value of the Thermosetting Resin Moulding Materials for Electronics.

On the basis of end-use, the global Thermosetting Resin Moulding Materials for Electronics market is segmented into Consumer Electronics, Automotive and Aerospace. Consumer Electronics segment account for more than half of the overall Thermosetting Resin Moulding Materials for Electronics mark`et by the end of forecast period.

Stringent regulations promoting the use of thermosetting resin moulding materials for electronics resins in automotive and aerospace industry

The automotive industry uses Thermosetting Resin Moulding Materials for Electronics resins and curing agents for a number of applications, including protective coatings, adhesives, light weight composite materials and others. The new Thermosetting Resin Moulding Materials for Electronics resin materials technology provides superior rust and corrosion protection. Epoxy coatings are used in most of the modern cars. The Sales of Thermosetting Resin Moulding Materials for Electronics in Automotive segment is projected to represent a total incremental opportunity of US$ 77.0 Mn between 2018 and 2026 while the Aerospace end use segment is projected to expand at a moderate CAGR in terms of value over the forecast period. The margins across various grades of Thermosetting Resin Moulding Materials for Electronics vary greatly. As a result, the companies are looking to achieve high purity levels of Thermosetting Resin Moulding Materials for Electronics, to leverage the much anticipated semiconductor industry.

The Thermosetting Resin Moulding Materials for Electronics market is expected to grow at attractive pace owing to high demand for epoxy moulding applications. The Asia Pacific region including China and Japan region is expected to gain traction in the Thermosetting Resin Moulding Materials for Electronics market. High Purity Quartz in Thermosetting Resin Moulding Materials for Electronics have limited suppliers that keeps profit margins in the industry are high.

thermosetting moulding materials electronics market

Market participants of the global thermosetting resin moulding materials for electronics market

Some of the market participants reported in this study of global Thermosetting Resin Moulding Materials for Electronics market include Unimin-Sibelco, Samsung SDI Co. Ltd.,  Golovach Quartz, Momentive,, The Quartz Corporation, Kyocera Chemical Corporation, Tosoh Corporation, ANZAPLAN GmbH, HPQ Silicon, Jiangsu Pacific Quartz Co.,Russian Quartz LLC –Kyshtym Mining –Sumitomo, Nordic Mining ASA, CB Minerals and others. The major strategies employed by producers of Thermosetting Resin Moulding Materials for Electronics include product development and strengthening of sales and distribution infrastructure. For e.g. Hexion Inc., over the past few years has launched various water-borne and other resin formulations that reduce the curing time as well as VOC emissions. There has been a significant improvement in performance and these resins can be used over a wide range of application areas including electronic board filling material.

With increasing demand from semiconductor applications, the demand for grade II and grade III segment is growing within Thermosetting Resin Moulding Materials for Electronics resins. The introduction of new Thermosetting Resin Moulding Materials for Electronics are expected to create new trends in the coming years

Company Profiles

  • Unimin-Sibelco
  • Golovach Quartz
  • The Quartz Corporation
  • Tosoh Corporation
  • ANZAPLAN GmbH
  • HPQ Silicon Resources Inc.
  • Jiangsu Pacific Quartz Co.
  • Russian Quartz LLC –Kyshtym Mining –Sumitomo
  • Nordic Mining ASA
  • CB Minerals
  • Ashland Global Holding Inc.
  • BASF SE
  • Chang Chun Plastics Co. Ltd.
  • Cosmic Plastics Inc.
  • Eastman Chemical Company
  • Evonik Industries AG
  • HenkelAG & Co. KGaA
  • Hexion Inc.
  • Hitachi Chemical Company Ltd.
  • Huntsman Corporation
  • Jiangsu Tianxin Chemical Co.,
  • Kolon Industries Inc.
  • Kyocera Chemical Corporation
  • Olin Corporation
  • Momentive Performance Materials, Inc.
  • Plastics Engineering Company (Plenco)
  • Rogers Corporation
  • Saudi Basic Industries Corporation (SABIC)
  • Sumitomo Bakelite
  • Others.
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