Comprehensive Snapshot for Automotive PCB Market Including Regional and Country Analysis in Brief
Industry: Automotive & Transportation
Published Date: April-2025
Format: PPT*, PDF, EXCEL
Delivery Timelines: Contact Sales
Number of Pages: 140
Report ID: PMRREP35221
The global automotive PCB market size is anticipated to be valued at US$ 10,397.2 Mn in 2025. The market is projected to grow by US$ 15,680.4 Mn between 2025 and 2032, at a CAGR of 6.1%. According to Persistence Market Research, the demand for automotive PCBs is witnessing significant growth on account of increasing focus on vehicle electrification, growing adoption of advanced driver assistance systems (ADAS), and government investments in smart infrastructure. For instance, in January 2025, the 5G Automotive Association (5GAA) signed a memorandum of understanding (MOU) with ITS India to drive innovation in autonomous and connected mobility. The collaboration aims to leverage cellular Vehicle to Everything (C-V2X), 5G, and AI-driven mobility to enhance road safety and ensure seamless vehicle connectivity.
Key Industry Highlights
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Global Market Attribute |
Key Insights |
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Automotive PCB Market Size (2025E) |
US$ 10,397.2 Mn |
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Market Value Forecast (2032F) |
US$ 15,680.4 Mn |
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Projected Growth (CAGR 2025 to 2032) |
6.1% |
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Historical Market Growth (CAGR 2019 to 2024) |
3.4% |
World Health Organization (WHO) reports that road accidents lead to over 1.19 million deaths and about 20 to 50 million injuries every year. The rising number of road accidents globally has led to an increased focus on vehicle safety, propelling automakers to integrate advanced safety systems. Features such as automatic emergency braking, lane departure warnings, and blind-spot detection rely on electronic control units powered by automotive printed circuit boards (PCBs). These safety electronics need to be fast, precise, and highly reliable to reduce accident risks.
As governments tighten safety regulations and consumers demand safer cars, there is a growing adoption of smart safety tech features. This is projected to boost the need for high-performance PCBs that support real-time data processing from sensors, cameras, and radar systems. Besides, the increasing focus on maintaining modern vehicle safety standards and reducing collision-related fatalities boost the market growth between 2025 and 2032.
High-performance PCBs used in modern vehicles require specialized substrates such as ceramic, aluminum, or high-Tg (glass transition temperature) laminates. These materials are essential for handling high temperatures, electrical loads, and long-term durability. However, their superior performance comes at a steep cost compared to standard FR-4 substrates. For instance, ceramic substrates can be 3 to 5 times more expensive than conventional alternatives, while aluminum-based PCBs may cost 50–100% more depending on thickness and design complexity.
The high cost of advanced materials is expected to be a significant barrier for automotive manufacturers targeting mid-level and low-level vehicle segments in low-cost vehicle regions of Africa, Southeast Asia, and Brazil. This cost sensitivity is expected to limit widespread adoption and pose a challenge for market growth to a certain extent during the forecast period
ADAS technologies such as lane-keeping assistance, adaptive cruise control, and automatic emergency braking require an array of sensors, cameras, radar systems, and high-performance processors. These components are critical for real-time data processing and communication between various vehicle systems. As car manufacturers focus on integrating ADAS features to enhance vehicle safety and comfort, the demand for automotive PCBs capable of handling high-frequency signals, large data volumes, and real-time processing is witnessing an uptick.
Moreover, the growing complexity of ADAS features is pushing manufacturers to develop more compact, heat-resistant, and high-speed PCBs to support real-time data transmission between multiple sensors and processors. For instance, in September 2024, ZF Group launched its next-generation ADAS platform known as the OnGuardMAX system. This platform is designed for scalable integration with both premium and mid-range vehicles that are equipped with advanced functions such as highway driving assistance and automated lane changes. As these systems require robust multi-layer and HDI PCBs to ensure seamless communication and processing accuracy, manufacturers are focusing on developing feature-rich ADAS systems. Such initiatives showcase exciting growth opportunities for companies present in the global market.
Based on vehicle type, the market is segmented into passenger cars and commercial vehicles. Out of these, the passenger car segment is anticipated to dominate and hold a share of about 70% in 2025. The high volume of production of passenger cars is projected to boost the adoption of advanced automotive PCBs across the globe. For instance, an automotive survey says that by 2028 around 98.01 million passenger car units will be sold globally.
Commercial vehicle, on the other hand, is projected to be the fastest-growing segment during the forecast period. The increasing adoption of sophisticated electronics such as telematics, fleet management systems, powertrain control modules, and advanced braking systems to enhance safety, efficiency, and connectivity in commercial vehicles is expected to boost the segment growth through 2032.
Based on type, the multi-layered segment is likely to dominate and hold the highest revenue share in the forthcoming years. Modern infotainment units are no longer limited to basic audio controls. They are now integrated with touchscreens, navigation, voice assistants, wireless connectivity (including Bluetooth, Wi-Fi, and 5G), real-time traffic data, and smartphone integration. These advanced features require the processing and transmission of large volumes of data simultaneously and seamlessly. Multi-layer PCBs are essential for supporting such functionality as they offer high component density, better signal integrity, and reduced electromagnetic interference (EMI). With car manufacturers investing more in infotainments systems, the segment is projected to witness substantial growth through 2032.
On the other hand, the FPC segment is likely to witness the fastest growth during the forecast period. Flexible PCBs are in huge demand on account of an increasing shift toward electric and autonomous vehicles. These vehicles require lightweight, bendable, and space-efficient electronic designs. FPCs are ideal for connecting compact modules such as sensors, cameras, and curved dashboard displays without requiring bulk wiring. As car interiors become sleeker and electronic systems more integrated, FPCs are gaining traction globally.
Asia Pacific is projected to dominate and hold a share of about 38% in 2025. Countries such as China, Japan, Taiwan, and South Korea are global hubs for both automotive manufacturing and the production of PCBs. The presence of major suppliers and original equipment manufacturers, along with supportive government initiatives for EVs and smart mobility, are anticipated to drive the market demand in the region between 2025 and 2032. For instance,
In February 2024, Thailand approved incentives for companies transitioning large truck and bus fleets to battery electric vehicles, including cash grants for EV battery cell manufacturers and tax deductions for adopting domestically manufactured EVs. This move has attracted significant investments from prominent carmakers such as BYD and Great Wall Motor, reinforcing Thailand's position as an EV manufacturing hub.
China's automotive PCB market is likely to experience considerable growth, fueled by the presence of a well-established electronics supply chain, strong EV push, and massive auto industry. China is home to major OEMs such as BYD, Geely, NIO, Tesla, and Volkswagen, all driving the country’s booming EV and smart vehicle ecosystem. With rising EV adoption, autonomous vehicle testing zones, and the integration of digital cockpits, demand for advanced automotive PCBs in the country is anticipated to witness a significant boost in the forthcoming years.
Europe is projected to register a fast growth in 2025 and is expected to maintain a positive outlook throughout the forecast period. A strong push towards vehicle electrification, digitalization, and sustainability drives the region’s rapid growth. Strict carbon emission regulations by the EU are accelerating the shift to EVs, which require complex electronic systems supported by high-performance PCBs. Additionally, increasing adoption of ADAS, infotainment, and V2X technologies is driving the need for advanced PCB architectures.
Countries such as Germany, France, and the Netherlands are investing heavily in EV infrastructure and smart mobility, creating a strong demand pipeline. Stringent regulations combined with technological innovation and growing EV penetration are likely to ensure Europe’s steady growth during the forecast period.
North America is projected to experience substantial growth driven by technological advancements, a strong automotive manufacturing base, and a growing focus on connected and electric vehicles. The U.S., in particular, is witnessing rising investments in EV production fueled by government incentives under the Inflation Reduction Act. The act was passed in 2022 and offers tax credits and incentives to promote EV manufacturing, battery production, and green technologies in the U.S. Major automakers such as Ford, General Motors, and Tesla are scaling up the production of EVs and autonomous vehicles, which demand sophisticated PCBs for battery management, ADAS, and infotainment systems. Such initiatives are expected to create considerable growth opportunities during the forecast period.
The global automotive PCB market is witnessing intense rivalry on account of increasing demand for electric and autonomous vehicles. Established players such as Nippon Mektron, Unimicron, and Meiko Electronic continue to lead with their advanced manufacturing capabilities and long-standing relationships with major automakers. However, the shift towards electrification and vehicle intelligence is opening doors for new entrants, particularly in the Asia Pacific. Manufacturers are increasingly becoming integral to the supply chain of emerging electric vehicle brands, capitalizing on the demand for high-frequency and high-density interconnect (HDI) PCBs required for advanced driver-assistance systems (ADAS) and battery management systems.
Moreover, companies are ramping up investments in expanding their manufacturing capabilities to maintain their presence. For example, in May 2024, Chin Poon Industrial, a Thailand-based company, announced an investment of US$ 27.3 million to expand its manufacturing facility. This move is expected to boost the company’s production capability of automotive PCBs.
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Report Attribute |
Details |
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Historical Data/Actuals |
2019 - 2024 |
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Forecast Period |
2025 - 2032 |
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Market Analysis |
Value: US$ Mn |
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Geographical Coverage |
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Segmental Coverage |
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Competitive Analysis |
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Report Highlights |
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Customization and Pricing |
Available upon request |
By Vehicle Type
By Type
By Application
By End-user
By Region
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The global market is projected to be valued at US$ 10,397.2 Mn in 2025.
The market is driven by an increasing shift towards vehicle electrification and the adoption of advanced driver assistance systems (ADAS).
The market is poised to witness a CAGR of 6.1% from 2025 to 2032.
High demand for flexible PCBs and growing integration of advanced multi-functional infotainment systems are the key market opportunities.
Major players in the smart parking systems industry include, Chin Poon Industrial, Meiko Electronics, TTM Technologies, KCE Electronics, and Tripod Technology.
