Global Market Study on Semiconductor Assembly and Testing Services (SATS): To be Driven by Increasing Demand for High-End Packaging Solutions


  • Published On : Nov-2015 |
  • Pages : 222 Pages |
  • Format :

The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions. However, with increasing competition, the price is expected to decrease in the foreseeable future. Major drivers propelling the market include: increasing demand for mobility and connectivity in consumer electronic products and increasing demand of advanced electronic systems in the automobiles Additionally, increasing demand for mobility and connectivity in the consumer electronic products and ability of SATS providers to facilitate a more efficient supply chain and reduced time-to-market are few other factors propelling the market growth. SATS providers offer additional features over in-house testing and packaging capabilities which is one of the primary factors for Integrated Device Manufacturers (IDM) to outsource the SATS services. In addition, the global market of semiconductor assembly and test services has been witnessing the emergence of strategic alliances and collaborations among the leading providers and manufacturers due to rising financial pressures.

Currently, more than 50% of the market accounted for Outsourced Semiconductor Assembly and Testing (OSAT) services, and this fraction is expected to increase during the forecast period. Although many of the low-end SATS providers are competing on price-driven products,

To understand and assess the opportunities in this market, the report is categorically split into three sections, namely, market analysis by services, application, and region. The services section is further sub-segmented on the basis of interconnecting technologies. The report analyzes the global semiconductor assembly and testing services market in terms of market value (US$ Mn).

The report starts with an overview of the global semiconductor assembly and testing services market and usage of these services in various applications across the globe. In the same section, PMR covers the global semiconductor assembly and testing services market performance in terms of revenue. This section includes PMR’s analysis of key trends, drivers, and restraints from supply and demand perspectives. Impact analysis of key growth drivers and restraints, based on the weighted average model, is included in this report to better equip clients with crystal clear decision-making insights.

The Semiconductor Assembly and Testing Services market is segmented as follows:

  • By Services
  • By Application
  • By Region

On the basis of services, the SATS market is segmented into:

  • Assembly & Packaging Services
  • Testing Services

Of these, the assembly & packaging services accounted for the highest share of the overall semiconductor assembly and testing services market in 2014. The semiconductor assembly and testing services market is mainly driven by factors such as increasing adoption of consumer electronics products such as tablet PCs and wearable devices (smart watches, head mounted devices, fitness equipment etc. in the developed economies.

The section that follows analyzes the market on the basis of packaging solutions and presents the market size in terms of value for the forecast period. 

On the basis of packaging solutions, the SATS market is segmented as follows:

  • Copper Wire and Gold Wire Bonding
  • Copper Clip
  • Flip Chip
  • Wafer Level Packaging
  • TSV

Of the above-mentioned segments, the wafer level packaging segment is expected to increase at the highest CAGR during the forecast period. However, the copper wire and gold wire bonding segment is expected to dominate the semiconductor assembly and testing services market in terms of value, by 2021.

On the basis of application the SATS market is segmented as follows:

  • Communication
  • Computing and Networking
  • Consumer electronics
  • Industrial
  • Automotive electronics

Of the aforementioned segments, the consumer electronics segment is expected to expand at the highest CAGR during the forecast period. However, the communications application segment is expected to dominate the semiconductor assembly and testing services market in terms of value, by 2021. Leading market participants are investing heavily in R&D activities in order to innovate new advanced packaging solutions that would cater to the growing demand of miniaturization and low power requirements. For instance, in May 2014, STATS chip PAC (now JCET) introduced innovative FlexLine Manufacturing line. This manufacturing line can process multiple silicon wafer diameters, and produce both fan-in and fan-out wafer level packages on it. Additionally, it pioneered the Through Silicon via (TSV) enabled 3D chip stacking technology in August 2013.

The report also analyzes the market on the basis of region and presents the market size in terms of value for the forecast period.

Regions covered in the report are as follows:

  • North America
  • Asia Pacific Excluding Taiwan
    • China
    • Japan
    • Singapore,
    • Thailand
    • The Philippines
  • Taiwan
  • Europe
  • The Middle East & Africa
  • Latin America

Of the aforementioned segments, the Taiwan market is expected to expand at the highest CAGR during the forecast period and is expected to remain largest market share, out of the total semiconductor assembly and testing services market in 2021.

The semiconductor industry is highly volatile in nature. Leading market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizes its expertise in enhancing the performance of the chipsets or ICs. Thus, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as Outsourced Semiconductor Assembly and Test Services (OSATS) Providers. Moreover, the shift of semiconductor processing technology to the larger wafers and smaller feature sizes has increased the cost of building a state-of-the-art wafer fabrication factory. High CAPEX involved in wafer fabrication and its associated packaging and test operations has enforced semiconductor companies to remain fabless and instead focus on their core business. As a result, SATS providers have witnessed high demand in the past and are expected to be sole choice for fabless companies during the foreseeable future.

The global semiconductor assembly & testing services market is anticipated to expand at a CAGR of 4.7% during the period 2015-2021 to reach US$ 39,050.7 Mn by 2021. 

The global semiconductor assembly & testing services market was valued at US$ 28,177.9 Mn in 2014. Increasing adoption of consumer electronics products including tablet PCs, wearable devices (smart watches, smart glasses, head mounted displays, fitness equipment etc.), gaming consoles, audio/video devices along with the rising penetration of smartphones in the communications segment is driving the overall SATS market growth. Additionally, growing technological advancements in next-generation cars (automotive electronics) equipped with enhancing car safety and management systems, are also driving the growth of SATS market.

In 2014, the assembly & packaging services segment was valued at US$ 22,298.9 Mn and is expected to account for US$ 23,494.8 Mn by the end of 2015. Advanced packaging solutions such as wafer level packages and flip chip are driving the market growth of packaging solutions (inter-connecting solutions) segment in the total SATS market.

In 2014, wafer level packaging segment was valued at US$ 3,508.9 Mn and is expected to reach US$ 3,800.6 Mn by the end of 2015. Growing adoption of wearable devices which mandates high performance with low power and thermal ratings, the demand for wafer-level packaging inter-connecting solution is expected to grow in the foreseeable future. This segment is analyzed to expand at a CAGR of 9.2% during the forecast period.

In 2014, consumer electronics application segment was valued at US$ 3,738.5 Mn and is analyzed to value US$ 3,999.6 Mn by the end of 2015. 

Key players in global semiconductor assembly & testing services market include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), Global Foundries and Chipbond Technology Corporation.

semiconductor-assembly-test-services-market

The leading players including:

  • ASE group.
  • STATS ChipPAC Ltd.
  • Amkor technology Inc.
  • Siliconware Precision Industries Co., Ltd (SPIL).
  • Other

Are focusing on obtaining the competitive edge by targeting the advanced expensive packages.

Table of Contents
 

1. Global Semiconductor Assembly and Testing Services Market- Executive Summary
 

2. Assumptions & Acronyms Used
 

3. Research Methodology
 

4. Market Overview
4.1. Introduction
    4.1.1. Global Semiconductor Assembly and Testing Services Market Definition
    4.1.2. Global Semiconductor Assembly and Testing Services Market Taxonomy
4.2. Global Semiconductor Assembly and Testing Services Market Dynamics
    4.2.1. Drivers
    4.2.2. Restraints
4.3. Value Chain
4.4. Global Semiconductor Assembly and Testing Services Market Forecast, 2015-2021
    4.4.1. Global Semiconductor Assembly and Testing Services Market Size (Value) Forecast
          4.4.1.1. Y-o-Y Growth Projections
          4.4.1.2. Absolute $ Opportunity
4.5. Global Semiconductor Assembly and Testing Services Market Trends
4.6. Global Semiconductor Assembly and Testing Services Market Snapshot (2014)
    4.6.1. Market Share By Services
    4.6.2. Market Share By Packaging Solutions
    4.6.3. Market Share By Applications
    4.6.4. Market Share By Regions

5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
    5.2.1. Assembly & Packaging services (Interconnecting technologies) 
          5.2.1.1.1. Copper and gold wire bonding
          5.2.1.1.2. Copper clip
          5.2.1.1.3. Flip Chip
          5.2.1.1.4. Wafer Level Packaging
          5.2.1.1.5. TSV
    5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services
5.7. Qualitative Analysis

6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
6.1. Introduction
6.2. Global Semiconductor Assembly and Testing Services Market Forecast By Packaging Solutions
    6.2.1. Copper/gold Wire Bonding
    6.2.2. Copper Clip
    6.2.3. Flip Chip
    6.2.4. Wafer Level Packaging
    6.2.5. 3D TSV
6.3. Basis Point Share (BPS) Analysis, By Packaging Solutions
6.4. Y-o-Y Growth Comparison, By Packaging Solutions
6.5. Absolute $ Opportunity, By Packaging Solutions
6.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions
6.7. Qualitative Analysis

7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
7.1. Introduction
7.2. Global Semiconductor Assembly and Testing Services Market Forecast By Applications
    7.2.1. Communications
    7.2.2. Computing & Networking
    7.2.3. Consumer Electronics
    7.2.4. Industrial
    7.2.5. Automotive Electronics
7.3. Basis Point Share (BPS) Analysis, By Applications
7.4. Y-o-Y Growth Comparison, By Applications
7.5. Absolute $ Opportunity
7.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions
7.7. Qualitative Analysis

8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
8.1. Introduction
8.2. Global Semiconductor Assembly and Testing Services Market Forecast By Region
    8.2.1. North America Market Value Forecast
    8.2.2. Asia Pacific (Excluding Taiwan) Market Value Forecast 
    8.2.3. Taiwan Market Value Forecast
    8.2.4. Europe Market Value Forecast
    8.2.5. Middle East & Africa Market Value Forecast
    8.2.6. Latin America Market Value Forecast
8.3. Y-o-Y Growth Projections, By Region
8.4. Basis Point Share (BPS) Analysis, By Region
8.5. Market Attractiveness Analysis, By Region

9. North America North America Semiconductor Assembly and Testing Services Market Analysis
9.1. Market overview
9.2. Introduction
    9.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
9.3. North America Semiconductor Assembly and Testing Services Market Forecast
    9.3.1. Market Value Forecast By Services
          9.3.1.1. Assembly & Packaging services 
          9.3.1.2. Testing services
                  9.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  9.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    9.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          9.3.2.1. Copper/gold wire bonding
          9.3.2.2. Copper Clip
          9.3.2.3. Flip Chip
          9.3.2.4. Wafer level Packaging
          9.3.2.5. 3D TSV
                  9.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  9.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    9.3.3. Market Value Forecast By Applications
          9.3.3.1. Communications
          9.3.3.2. Computing and Networking
          9.3.3.3. Consumer Electronics
          9.3.3.4. Industrial
          9.3.3.5. Automotive Electronics
                  9.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  9.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    9.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          9.3.4.1. By Services
          9.3.4.2. By Packaging Solutions
          9.3.4.3. By Applications
    9.3.5. Drivers & Restraints: Impact Analysis

10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
10.1. Market overview
10.2. Introduction
    10.2.1. Y-o-Y Growth Projections, By Country
    10.2.2. Basis Point Share (BPS) Analysis, By Country
10.3. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Forecast
    10.3.1. Market Value Forecast By Country
          10.3.1.1. China Absolute $ Opportunity
          10.3.1.2. Japan Absolute $ Opportunity
          10.3.1.3. Singapore Absolute $ Opportunity
          10.3.1.4. Thailand Absolute $ Opportunity
          10.3.1.5. Philippines Absolute $ Opportunity
                  10.3.1.5.1. Y-o-Y Growth Comparison, By Countries
                  10.3.1.5.2. Basis Point Share (BPS) Analysis, By Countries
    10.3.2. Market Value Forecast By Services
          10.3.2.1. Assembly & Packaging services 
          10.3.2.2. Testing services
                  10.3.2.2.1. Y-o-Y Growth Comparison, By Services
                  10.3.2.2.2. Basis Point Share (BPS) Analysis, By Services
    10.3.3. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          10.3.3.1. Copper/gold wire bonding
          10.3.3.2. Copper Clip
          10.3.3.3. Flip Chip
          10.3.3.4. Wafer level Packaging
          10.3.3.5. 3D TSV
                  10.3.3.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  10.3.3.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    10.3.4. Market Value Forecast By Applications
          10.3.4.1. Communications
          10.3.4.2. Computing and Networking
          10.3.4.3. Consumer Electronics
          10.3.4.4. Industrial
          10.3.4.5. Automotive Electronics
                  10.3.4.5.1. Y-o-Y Growth Comparison, By Applications
                  10.3.4.5.2. Basis Point Share (BPS) Analysis, By Applications
    10.3.5. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          10.3.5.1. By countries
          10.3.5.2. By Services
          10.3.5.3. By Packaging Solutions
          10.3.5.4. By Applications
    10.3.6. Drivers & Restraints: Impact Analysis

11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
11.1. Market overview
11.2. Introduction
    11.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
11.3. Taiwan Semiconductor Assembly and Testing Services Market Forecast
    11.3.1. Market Value Forecast By Services
          11.3.1.1. Assembly & Packaging services 
          11.3.1.2. Testing services
                  11.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  11.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    11.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          11.3.2.1. Copper/gold wire bonding
          11.3.2.2. Copper Clip
          11.3.2.3. Flip Chip
          11.3.2.4. Wafer level Packaging
          11.3.2.5. 3D TSV
                  11.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  11.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    11.3.3. Market Value Forecast By Applications
          11.3.3.1. Communications
          11.3.3.2. Computing and Networking
          11.3.3.3. Consumer Electronics
          11.3.3.4. Industrial
          11.3.3.5. Automotive Electronics
                  11.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  11.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    11.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          11.3.4.1. By Services
          11.3.4.2. By Packaging Solutions
          11.3.4.3. By Applications
    11.3.5. Drivers & Restraints: Impact Analysis

12. Europe Semiconductor Assembly and Testing Services Market Analysis
12.1. Market overview
12.2. Introduction
    12.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
12.3. Europe Semiconductor Assembly and Testing Services Market Forecast
    12.3.1. Market Value Forecast By Services
          12.3.1.1. Assembly & Packaging services 
          12.3.1.2. Testing services
                  12.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  12.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    12.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          12.3.2.1. Copper/gold wire bonding
          12.3.2.2. Copper Clip
          12.3.2.3. Flip Chip
          12.3.2.4. Wafer level Packaging
          12.3.2.5. 3D TSV
                  12.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  12.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    12.3.3. Market Value Forecast By Applications
          12.3.3.1. Communications
          12.3.3.2. Computing and Networking
          12.3.3.3. Consumer Electronics
          12.3.3.4. Industrial
          12.3.3.5. Automotive Electronics
                  12.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  12.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    12.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          12.3.4.1. By Services
          12.3.4.2. By Packaging Solutions
          12.3.4.3. By Applications
    12.3.5. Drivers & Restraints: Impact Analysis

13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
13.1. Market overview
13.2. Introduction
    13.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
13.3. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Forecast
    13.3.1. Market Value Forecast By Services
          13.3.1.1. Assembly & Packaging services 
          13.3.1.2. Testing services
                  13.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  13.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    13.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          13.3.2.1. Copper/gold wire bonding
          13.3.2.2. Copper Clip
          13.3.2.3. Flip Chip
          13.3.2.4. Wafer level Packaging
          13.3.2.5. 3D TSV
                  13.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  13.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    13.3.3. Market Value Forecast By Applications
          13.3.3.1. Communications
          13.3.3.2. Computing and Networking
          13.3.3.3. Consumer Electronics
          13.3.3.4. Industrial
          13.3.3.5. Automotive Electronics
                  13.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  13.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    13.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          13.3.4.1. By Services
          13.3.4.2. By Packaging Solutions
          13.3.4.3. By Applications
    13.3.5. Drivers & Restraints: Impact Analysis

14. Latin America Semiconductor Assembly and Testing Services Market Analysis
14.1. Market overview
14.2. Introduction
    14.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity
14.3. Latin America Semiconductor Assembly and Testing Services Market Forecast
    14.3.1. Market Value Forecast By Services
          14.3.1.1. Assembly & Packaging services 
          14.3.1.2. Testing services
                  14.3.1.2.1. Y-o-Y Growth Comparison, By Services
                  14.3.1.2.2. Basis Point Share (BPS) Analysis, By Services
    14.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)
          14.3.2.1. Copper/gold wire bonding
          14.3.2.2. Copper Clip
          14.3.2.3. Flip Chip
          14.3.2.4. Wafer level Packaging
          14.3.2.5. 3D TSV
                  14.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions
                  14.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions
    14.3.3. Market Value Forecast By Applications
          14.3.3.1. Communications
          14.3.3.2. Computing and Networking
          14.3.3.3. Consumer Electronics
          14.3.3.4. Industrial
          14.3.3.5. Automotive Electronics
                  14.3.3.5.1. Y-o-Y Growth Comparison, By Applications
                  14.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications
    14.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis
          14.3.4.1. By Services
          14.3.4.2. By Packaging Solutions
          14.3.4.3. By Applications
    14.3.5. Drivers & Restraints: Impact Analysis

15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
    15.4.1. ASE Group
          15.4.1.1. Revenue
          15.4.1.2. Products/Brand Offerings
          15.4.1.3. Company Highlights
    15.4.2. Amkor Technology Inc.
    15.4.3. STATS chipPAC Ltd. (JCET)
    15.4.4. Powertech Technology Inc.
    15.4.5. Silicon Precision Industries Company Ltd.
    15.4.6. CORWIL Technology Corp.
    15.4.7. Chipbond Technology Corporation
    15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
    15.4.9. GlobalFoundries Inc.


List of Tables
 

Table 1: Global Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 2: Global Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 3: Global Semiconductor Assembly and Testing Services Market Size Forecast By Applications (US$ Mn)
Table 4: Global Semiconductor Assembly and Testing Services Market Size Forecast By Geography (US$ Mn)
Table 5: North America Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 6: North America Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 7: North America Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)
Table 8: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Country (US$ Mn)
Table 9: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 10: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 11: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)
Table 12: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 13: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 14: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)
Table 15: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 16: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 17: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)
Table 18: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 19: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast by Packaging solutions (US$ Mn)
Table 20: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)
Table 21: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)
Table 22: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)
Table 23: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)


List of Figures 


Figure 1: Global Semiconductor Assembly and Testing Services Market Incremental Opportunity, 2014–2021
Figure 2: Global Semiconductor Assembly and Testing Services Market Revenue by Services, 2014
Figure 3: Global Semiconductor Assembly and Testing Services Market Revenue By Application, 2014
Figure 4: Global Semiconductor Market Absolute $ Opportunity, 2014–2021
Figure 5: Global Semiconductor Market Y-o-Y Growth, 2014–2021
Figure 6: Global Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021
Figure 7: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth, 2014–2021
Figure 8: Global Semiconductor Assembly and Testing Services Market – Scenario Forecast
Figure 9: Market value of IoT devices, 2013 – 2020
Figure 10: Fluctuation in exchange rates, 2010–2015 (US$/NT$)
Figure 11: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021
Figure 12: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021
Figure 13: Global Assembly & Packaging Services Segment Absolute $ Opportunity, 2014–2021
Figure 14: Global Testing services Segment Absolute $ Opportunity, 2014–2021
Figure 15: Global Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021
Figure 16: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021
Figure 17: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021
Figure 18: Global Copper Wire & Gold Wire Bonding Segment Absolute $ Opportunity, 2014–2021
Figure 19: Global Copper Clip Segment Absolute $ Opportunity, 2014–2021
Figure 20: Global Flip Chip Segment Absolute $ Opportunity, 2014–2021
Figure 21: Global Wafer Level Packaging Segment Absolute $ Opportunity, 2014–2021
Figure 22: Global TSV Segment Absolute $ Opportunity, 2014–2021
Figure 23: Global Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021
Figure 24: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021
Figure 25: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021
Figure 26: Global Communications Segment Absolute $ Opportunity, 2014–2021
Figure 27: Global Computing & Networking Segment Absolute $ Opportunity, 2014–2021
Figure 28: Global Consumer electronics Segment Absolute $ Opportunity, 2014–2021
Figure 29: Global Industrial Segment Absolute $ Opportunity, 2014–2021
Figure 30: Global Automotive electronics Segment Absolute $ Opportunity, 2014–2021    
Figure 31: Global Semiconductor Assembly and Testing Services Market Attractiveness by Application, 2015–2021    
Figure 32: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Geography, 2014 & 2021    
Figure 33: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Geography, 2014–2021    
Figure 34: Global Semiconductor Assembly and Testing Services Market Attractiveness by Geography, 2015–2021    
Figure 35: North America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 36: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 37: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 38: North America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 39: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    
Figure 40: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 41: North America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 42: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Application, 2014 & 2021
Figure 43: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    
Figure 44: North America Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 45: APAC Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 46: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By countries, 2014 & 2021    
Figure 47: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison By countries, 2014–2021    
Figure 48: North America Semiconductor Assembly and Testing Services Market Attractiveness By countries, 2015–2021    
Figure 49: APAC  Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 50: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 51: North America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 52: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    
Figure 53: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 54: North America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 55: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    
Figure 56: APAC Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    
Figure 57: APAC Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 58: Taiwan Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 59: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 60: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 61: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 62: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    
Figure 63: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 64: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 65: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    
Figure 66: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    
Figure 67: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 68: Europe Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 69: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 70: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 71: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 72: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    
Figure 73: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 74: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 75: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    
Figure 77: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 78: MEA Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 79: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 80: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 81: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 82: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021
Figure 83: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 84: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 85: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    
Figure 86: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    
Figure 87: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 88: Latin America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    
Figure 89: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    
Figure 90: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    
Figure 91: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    
Figure 92: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    
Figure 93: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    
Figure 94: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    
Figure 95: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Application, 2014 & 2021
Figure 96: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    
Figure 97: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    
Figure 98: Market Share Analysis (%), 2014

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